In a significant step towards creating an end-to-end semiconductor manufacturing ecosystem in India, the function for commencement of construction of Tata’s semiconductor unit in Assam unit was held in the presence of Chief Minister of Assam, Himanta Biswa Sarma and Chairman of Tata Sons Limited N Chandrasekaran.
Union Minister for Railways, Electronics & Information Technology and Information and Broadcasting, Ashwini Vaishnav mentioned that this project was approved by the Union Cabinet on 29th February, 2024.
The Union Minister mentioned that this unit will be set up with an investment of Rs. 27 thousand crores and is expected to generate 15 thousand directand11-13 thousand indirect jobs. While highlighting the importance of the Semiconductor industry as being a foundational one, he said that employment opportunities in various upstream and downstream industries will be created.
The proposed capacity of this unit is 4.83 crore semiconductor chips per day. He also pointed out that this unit will be the site for development of indigenous advanced semiconductor packaging technologies including Wire Bond, flip chip and I-SIP (integrated system in package) technologies and all these three major technologies which will be deployed in this plant are being developed in India. These technologies are extremely critical for key applications such as automotive (especially electric vehicles), communications, network infrastructure and others
The Union Minister also mentioned that85,000 industry-ready workforceat B.Tech, M.Tech and PhD level in semiconductor chip design are being trained at 113 academic institutions across the country.
